ligitek electronics co.,ltd. property of ligitek only lhr9ug2092/r22-pf dual color led lamps data sheet doc. no : qw0905- rev. : date : 16 - oct. a - 2012 lhr9ug2092/r22-pf lead-free parts pb l dcc
ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 1.cathode green 2.common anode 3.cathode red 25% 75% 100% 50% hr 9ug -60 x -30 x 75% 25% 050%100% 0 x 30 x 60 x 1 2 3 2.54typ 2.0min 18.0min 2.54typ 2.0min part no. 4.2 6.7 ? 0.5 5.2 ?? 0.5 typ 1.5 max 3 2 1 3.0 4.0 lhr9ug2092/r22-pf page 1/6
operating temperature -40 ~ +85 t opr j peak wave length f dnm viewing angle 2 c 1/2 (deg) lhr9ug2092/r22-pf note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. 20 574 white diffused red gaalas green emitted 20 660 lens 1.7 2.6 60 60 2.4 1.5 min. max. min. typ. storage temperature part no typical electrical & optical characteristics (ta=25 j ) color material spectral halfwidth ??f nm forward voltage @20ma(v) luminous intensity @20ma(mcd) -40 ~ +100 tstg j part no. lhr9ug2092/r22-pf page 2/6 absolute maximum ratings at ta=25 j power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current i f ma 30 30 ir 10 pd 100 i fp 100 10 g a 75 mw 60 ma absolute maximum ratings parameter symbol unit ligitek electronics co.,ltd. property of ligitek only algainp v 2000 electrostatic discharge( * ) esd 65 160 12 28 peak wave length f pnm red green
ambient temperature( j ) fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 j -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 relative intensity@20ma normalize @25 j -20 ambient temperature( j ) 80 60 40 20 0-40 100 0.0 80 60 02040 100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 forward current(ma) 0.1 1.0 10 1.0 1000 hr chip relative intensity normalize @20ma 0.5 forward voltage(v) 2.0 3.0 4.0 5.0 1.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 10 100 1000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 3/6 page part no. lhr9ug2092/r22-pf relative intensity@20ma wavelength (nm) 0 600 0.5 650 650 700 750 fig.5 relative intensity vs. wavelength 1.0
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 ug chip 4/6 page part no. lhr9ug2092/r22-pf 0 500 0.5 1.0 550 600 650
lhr9ug2092/r22-pf part no. page 5/6 2.wave soldering profile temp(c) 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 5 /sec max 100 150 time(sec) 120x preheat 50 25x 0 0x 60 seconds max 2 /sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 260x soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 j ? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 j ? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 j ? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=245 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not. lhr9ug2092/r22-pf part no. page 6/6
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